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Pervasive Engineering Simulation

Pervasive Engineering Simulation

As automobiles learn to drive themselves, adding simulated miles driven to actual road testing is the only way to ensure that our roads will be safer. Simulating the build of a metal part by additive manufacturing is similarly the only way to make sure the part will be strong and reliable, suitable for its intended task. When the only way is also the fastest and least expensive way to overcome a design, manufacturing or operations challenge, everyone wins.

ANSYS 19.1 is the latest step in our continuing effort to improve simulation so it can tame the complexity of our interconnected world. In every area of physics, we are striving to provide a comprehensive solution to your engineering challenges so you don’t have to go outside ANSYS to complete a project. That means we are constantly studying new developments in all areas of technology to produce simulation solutions for innovations in engineering. ANSYS 19.1 contains advances in the simulation of structures, fluids, electromagnetics, semiconductors, systems and certified software that improve reliability, performance, speed and user experience. So pervasive engineering simulation — often the only and best solution — keeps getting better.

3D Design

With ANSYS 19.1, every designer can experience the power of upfront concept development, and more rapidly and confidently explore design spaces in greater depth — before validation through flagship solvers. Since the commercial launch of Discovery Live, we’ve continued to gather user feedback and perfect Discovery Live’s real-time simulation capability. We’ve significantly improved techniques for fluid calculations to make them more accurate and robust. Discovery SpaceClaim offers enhanced visualization of connecting bodies through shared topology. Additionally, the many workflow and post-processing improvements in Discovery AIM allow users to achieve desired results data faster. Learn more: Register now for an update-filled webinar.

Electromagnetics

ANSYS 19.1 delivers powerful new analysis capabilities for designing wireless communication, autonomous and electrification technologies. New features include ADAS/automotive radar, large target radar cross section (RCS) analysis, integrated electrothermal analysis, an innovative electric machine design kit and new hybrid simulation techniques for printed circuit board (PCB) analysis. Additionally, comprehensive system modeling capabilities are now included with all electromagnetic field simulation products. These provide a multiphysics, multi-technology-based workflow that will spur your engineering innovation to surpass your competition.

Embedded Software

ANSYS 19 delivers powerful capabilities for workflow integration, performance and usability, plus fully certified embedded software and human machine interface (HMI) design capabilities, and dedicated solutions for automotive and avionics systems and software. New features include multi-rate applications design capabilities, enhanced HMI design capabilities that comply with ARINC 661 and are qualifiable for ISO 26262 and DO-178C. For avionics systems and automotive developers, release 19 incorporates architecture analysis and design language model-based system design.

Fluids

With ANSYS 19, every engineer can create better, more accurate computational fluid dynamics (CFD) simulations. Engineers will benefit greatly from continuing improvements in automation, productivity and workflows. In addition, ANSYS 19 includes new features and functionality that enable engineers to solve CFD problems with more accuracy than ever before, especially for phenomena that were too difficult or time-consuming to simulate using previous methods. ANSYS 19 also introduces ANSYS Chemkin Enterprise for fast, accurate combustion and reacting flow simulation in a single license and ANSYS EnVIsion Pro, a new way to review EnSight data.

Semiconductors

Next-generation automotive, mobile and high-performance computing applications demand the use of advanced SoCs that are bigger, faster and more complex. ANSYS 19.1 for semiconductors provides comprehensive simulation solutions that simultaneously solve for various design attributes such as power noise, process/voltage/timing variability, thermal effects, reliability and performance across the spectrum of chip, package and system. ANSYS RedHawk-SC, the big data simulation platform, enables rapid design iterations across multiple operating conditions; its actionable analytics can be used to prioritize design fixes and accelerate time to market. ANSYS semiconductor solutions are foundry-certified by all major foundries for advanced FinFET process technologies including TSMC’s most recent 5nm FinFET process technology for early design starts and multi-die analysis for WoW (Wafer on Wafer) and CoWoS (Chip on Wafer on Substrate) advanced packaging technologies.

Structures

ANSYS Mechanical is now more powerful with enhancements to boost productivity for engineers in all industries and at all levels. You can perform structural analysis more quickly with faster solvers and increased availability of high performance compute cores with ANSYS Mechanical Pro, ANSYS Mechanical Premium and ANSYS Mechanical Enterprise licenses. Advances include fracture analysis and enhanced acoustic simulation capabilities. For those of you doing additive manufacturing, we have added the new Additive Suite product so you can simulate your metal additive manufacturing process beforehand and enhance your first-time build success rate.

Systems

With ANSYS 19.1, we are introducing ANSYS Twin Builder, a powerful new product that allows you to build, validate and deploy digital twins. To easily and quickly build your system, ANSYS Twin Builder combines the power of a multidomain systems modeler with extensive 0D application-specific libraries, 3D physics solvers and ROM capabilities. The product also includes embedded software development tools. All of these features enable you to reuse existing components and quickly create a systems model of your product. To validate your system, Twin Builder combines multidomain systems simulation capabilities with rapid HMI prototyping, systems optimization and XIL validation tools, ensuring that your system design will perform as expected. To connect your digital twin to its physical counterpart for testing with real-time data, ANSYS Twin Builder easily integrates with Industrial Internet of Things platforms. It contains run time deployment options, so you can perform predictive maintenance on your physical product. ANSYS Twin Builder is the only product that offers a comprehensive approach for your digital twin strategy.

 

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